Problem

Problem

The customer was using devices from a previous supplier to populate their ARINC modules. That previous supplier ceased producing the chips (End Of Life). The requirements were understood for the devices, but details of the implementation were unknown. The devices needed to be produced in ITAR registered facilities. Due to the packaging requirements, the ASICs needed to be delivered in tested, singulated die form.

Solution

Solution

iSine engineers reviewed the design goals for the device with the customer and developed a new specification for the ASIC. The design spec was reviewed and accepted by the customer.

Special consideration was made in the design of the ASIC to ensure it was not as susceptible to environmental conditions. It was developed in a mature semiconductor process node with good yield.

The design was performed using SPICE modeling for the analog sections and VHDL for the digital sections. I/O cells and power-and-ground pads were custom designed to meet the low power, high performance requirements.

The final assembly needed to have the die delivered with solder balls for attachment to the flexible circuit board. iSine directed the assembly house to attach the correct size solder balls and to provide the devices in a tape-and-reel format to allow for easier final assembly.

Results

Results

The ASIC met all of the goals as defined in the specifications and was successful in meeting the customer requirements. It is shipping in volume and in use by the end customer.

It met both the schedule and cost goals set forth by the customer at the start of the project and is yielding well in the final assembly.

The ASIC was integrated in X-Fab’s 0.35µm technology.